Fidest – Agenzia giornalistica/press agency

Quotidiano di informazione – Anno 31 n° 259

The “Global Semiconductor Packaging Materials Market 2017-2021”

Posted by fidest press agency su venerdì, 29 dicembre 2017

semiconduttoriThe report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors operating in this market. One of the major drivers for this market is the increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT. There is an increasing drive toward the mobility of electronic devices, worldwide. To be portable and cost-effective, they need to be lightweight and small. This trend toward the adoption of smaller form factors has called for innovative developments in the semiconductor packaging materials. Packaging technologies such as SiP, PoP, Flip-chip, and WLP is driving the development of new material solutions.For instance, a conductive bump is soldered on top of the flipped chip in flip-chip packaging, that acts as an interconnect with the lead frame or substrate. It ensures high system density and improved performance in miniaturized packages. With increasing functionalities required from the small device, the SiP technology is employed as it packs in ICs of different functionalities along with other passive components such as connectors and filters.

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