Fidest – Agenzia giornalistica/press agency

Quotidiano di informazione – Anno 33 n° 335

Posts Tagged ‘intel’

Intel and PADT Executives Elected to Chair Positions on the Arizona Technology Council Board of Directors

Posted by fidest press agency su lunedì, 22 luglio 2019

The Arizona Technology Council today announced David Tuhy, general manager, NSG Software Division, Intel®, and Eric Miller, co-founder and principal, PADT, were elected unanimously by the Council’s board of directors to serve as chair and vice-chair, respectively, for terms ending October 31, 2019.“Both David and Eric have made significant contributions to the Council’s strategy and overall success during their tenure on the board,” said Steven G. Zylstra, the Council’s president and CEO. “Their knowledge of the innovation ecosystem and expertise in their respective fields will continue to be an important asset as we advance our agenda designed to boost the economic contributions the technology industry brings to Arizona.”
In addition to Tuhy and Miller’s appointments, the following members have been elected to the executive committee for terms ending October 31, 2019 – Rebecca Clyde, CEO and co-founder,, Kerry Zunkowski, vice president of People Operations, KEAP, and Rick Nielsen, director of technology, Operations and Engineering, Cox Communications. All Officers and Executive Committee members are elected or reelected for one-year terms at the annual board meeting in October.The Council’s board of directors serve an advisory and fiduciary role by representing the interests of the state’s technology industries in the Council’s strategic planning and ongoing operations. The current board includes 36 members representing a diverse set of organizations.Tuhy, Miller, Clyde, Zunkowski and Nielsen provide deep experience in a wide range of technology sectors and possess a diverse skill set that will contribute to the Arizona technology community’s continued growth.

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Intel Announces Program for Israeli Startups Targeting Tech Inflections

Posted by fidest press agency su martedì, 18 giugno 2019

Based in Tel Aviv, the program called Ignite will leverage Intel’s global market access and business and technology leadership to provide early-stage startups with unique advantages on their paths to disrupt the future. Following a rigorous selection process, Intel will host 10 to 15 top pre-seed to seed startups through a 20-week program where they will receive hands-on mentorship from Intel and industry experts in a variety of product, business, management and technical areas. Intel is committed to accelerate their growth and scale their ideas for greater impact.“Intel has always worked in concert with open ecosystems to scale new technologies so they can be transformational for our customers, business and society. This process is fueled by the innovation and passion of the startup community,” said Intel CEO Bob Swan. “Israel has the deep skill base in AI, autonomous systems and the underlying technologies critical to these inflections that make it a natural choice to launch our Ignite program.”The Ignite program will begin operations in Israel this year, with plans to scale to additional countries over time. Diversity will be an important guiding principle of Ignite, with startups established, owned and run by different representatives of Israel’s diversified social mix. Intel has no plans to seek equity in or rights to intellectual property from these companies.Tzahi (Zack) Weisfeld, former global head of Microsoft for Startups, will serve as general manager and managing director of Ignite, reporting to Yaniv Garty, general manager of Intel Israel. Weisfeld will be assisted by Avner Goren, Intel vice president in the Architecture, Graphics and Software Group, who will connect the Ignite program to the technical community inside Intel.

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Intel at Mobile World Congress 2019

Posted by fidest press agency su domenica, 3 febbraio 2019

Barcelona Feb. 25-28 Fira Gran Via, Hall 3, Intel Booth 3E31 At Mobile World Congress 2019, Intel will demonstrate solutions powering the 5G future. Come experience compelling use cases highlighting the power of 5G across client, cloud, network and edge, enabling Intel customers to deliver new innovative capabilities and scalable and efficient business models. As the world moves beyond connecting billions of humans to connecting billions of “things,” Intel’s world-class data-centric technologies and solutions will drive 5G’s usefulness and presence everywhere.
See how delivering 5G’s expanded capacity in a manufacturing setting will enable safer, more flexible and more efficient production by applying machine-to-machine connectivity, transformed networks, computer vision, edge computing and AI capabilities to real-world applications.
Learn how edge computing will enable new revenue-generating, immersive media experiences (virtual reality/augmented reality gaming) for consumers anywhere, without being tethered to a wired network. See how Hollywood is embracing the power of Intel processing and software and the visual cloud to bring its latest films to life.
5G’s gigabit speeds, transformed networks and edge computing augmented by new computer vision and AI technologies will give retailers new capabilities to efficiently enable retail deployments in virtually any location without the expense of a wired infrastructure.
See the latest Intel partner ecosystem offerings in network, edge, vRAN and base station technology – enabled by Intel® Xeon® Scalable processors, Intel® FPGAs, Intel Atom® processors, and Intel connectivity products.

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Intel Promotes Three Corporate Officers

Posted by fidest press agency su sabato, 28 luglio 2018

Intel Corporation today announced that its board of directors has promoted three corporate officers.“These promotions recognize the expanded scope and significance of the organizations for each of these proven Intel leaders,” said Intel CFO and interim CEO Bob Swan. “These leaders are helping us achieve our transformation from a PC-centric to a data-centric company, and I look forward to their continued contributions.” Michelle Johnston Holthaus was promoted from corporate vice president to senior vice president. Holthaus is the general manager of Intel’s Sales and Marketing Group and the interim chief marketing officer. She is responsible for global sales and revenue at Intel and leads the company’s efforts to foster innovative sales and marketing approaches that broaden Intel’s business opportunities and enhance customer relationships worldwide. Holthaus joined Intel in 1996 and is based in Hillsboro, Oregon.Daniel (Dan) McNamara was promoted from corporate vice president to senior vice president. He is the general manager of the Programmable Solutions Group at Intel. He is responsible for the P&L, strategy and execution of the company’s programmable hardware, IP, and software solutions and power product portfolio. McNamara joined Intel in December 2015, upon the close of Intel’s acquisition of Altera Corporation, and is based in Santa Clara, California.Allon Stabinsky was promoted from corporate vice president to senior vice president. He is the chief deputy general counsel of the Law and Policy Group at Intel. He currently leads the global Intel Legal department. Previously, Stabinsky was the deputy general counsel for the Solutions Legal Group and chief compliance officer, with leadership responsibilities for legal support of Intel’s Technology and Manufacturing Group and Sales and Marketing Group. Stabinsky joined Intel in 2005 and is based in Santa Clara, California.

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Inside An Intel Chip Fab: One Of The Cleanest Conference Rooms On Earth

Posted by fidest press agency su martedì, 3 aprile 2018

No dust mops needed here. The inside of a chip factory is cleaner than about any other place you can visit on Earth. To avoid contaminating the chip-making process, the air in an Intel fab clean room is filtered to 1,000 times fewer airborne particles than a sterile hospital operating room.
Intel operations leaders gather for the daily “8:20” – a morning huddle inside Fab D1X to ensure that the Hillsboro, Oregon, chip factory is running smoothly. Up to 30 people may squeeze into this room to confer on factory tool status, parts availability, operating forecasts, experts who may be needed or other urgent issues. The fab – the size of four football fields – runs 24/7/365. (Credit: Walden Kirsch/Intel Corporation)The “Team Room” inside Intel’s Fab D1X in Hillsboro, Oregon, is unique.
It’s the sole conference room inside this entire multibillion-dollar factory. Though the fab sprawls over four football fields, every square foot is supremely expensive and valuable. That’s why Intel designed leading-edge Fab D1X with one and only room like this.
Anything entering the fab – including the Fab D1X Team Room – must be thoroughly scrubbed or swabbed. Human skin and hair must be almost entirely covered. Workers wear head-to-toe bunny suits, protective glasses, two pairs of gloves, booties, hoods, and face masks. Workers often recognize one another by their build or their gait, not their face.In the D1X Team Room, anything that could shed particulates is verboten. No makeup, for example. Common supplies like paper and pencils are off-limits too – they both can create micro-dust. Only ink pens and special fab-approved synthetic paper are allowed in. This is the first photo inside the D1X Team Room ever shared externally.

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Accordo Ingenico e Intel per l’Internet of Things

Posted by fidest press agency su sabato, 2 Maggio 2015

san franciscoSan Francisco e Parigi – Ingenico Group (Euronext: FR0000125346 – ING) e Intel Corporation hanno annunciato una collaborazione per combinare le tecnologie Intel e Ingenico e realizzare soluzioni di accettazione di pagamenti sicuri sull’Internet of Things. Le aziende svilupperanno congiuntamente un tablet mobile che supporti nativamente i requisiti bancari EMV(1) e le funzionalità di pagamento NFC, nel rispetto degli standard imposti dal mondo bancario per prevenire le frodi con carta di credito.
Oggi, le banche sono responsabili per le attività fraudolente effettuate sulle carte di credito da loro emesse: si calcola che questo sia costato oltre 14 miliardi di dollari solo nel 2013(2). Da ottobre 2015, anche negli USA, come avviene in Europa già da 10 anni, le banche imporranno ai commercianti l’uso di dispositivi POS più sicuri e inizieranno a diffondere le carte a microchip EMV. I commercianti che non si adegueranno ai nuovi standard di sicurezza saranno considerati responsabili per i rimborsi delle cifre frodate qualora la frode dovesse essere fatta presso il loro negozio!In virtù di questa collaborazione, la tecnologia Intel® Data Protection Technology for Transactions sarà combinata con l’esperienza di Ingenico Group nell’accettazione di pagamenti basati su carte EMV e in mobilità. Il mercato statunitense, ma non solo, beneficerà di nuovi strumenti sicuri per i pagamenti, inizialmente realizzati sotto forma di nuovi tablet professionali, ma in futuro integrabili in nuovi dispositivi e sistemi basati sulla piattaforma Intel® Atom™.Questa nuova soluzione agevolerà la diffusione dei pagamenti sicuri EMV in una ampia serie di dispositivi che erogano Servizi a Valore Aggiunto all’interno degli esercizi commerciali di ogni dimensione: dai distributori automatici intelligenti alle casse mobili, dal digital signage ai chioschi multifunzionali. In genere su tutti i dispositivi intelligenti dell’Internet of Things.”Siamo molto lieti di iniziare questa collaborazione con Intel, sviluppando sistemi di accettazione sicuri per una moltitudine di dispositivi interconnessi”, ha commentato Philippe Lazare, presidente e amministratore delegato di Ingenico Group. “Questo è un ottimo esempio di come l’innovazione possa agevolare e rendere più sicura l’esperienza di acquisto e migliorare ulteriormente il rapporto tra il commerciante e il suo cliente. Portare i pagamenti sicuri in tutti i dispositivi presenti nei negozi e collegati tra loro, darà un importante valore aggiunto all’Internet of Things”.”Il cambiamento di tecnologia nei sistemi di pagamento che partirà in USA questo ottobre sarà una tappa importante per le banche e per tutte le società di carte di credito, ma soprattutto cambierà la vita di molti commercianti”, ha affermato Doug Davis, vice-president senior e direttore generale per l’Internet of Things di Intel. “Intel e Ingenico Group stanno lavorando per garantire la maggiore sicurezza ai commercianti che accettano carte di credito e, nello stesso tempo, progettare nuovi dispositivi di accettazione che siano facili da installare e gestire come gli attuali sistemi in dotazione dei retailer, in modo da non creare nuovi oneri per i commercianti.”

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Intel Security dice addio al problema delle password

Posted by fidest press agency su martedì, 3 marzo 2015

intel securityMobile World Congress, Barcellona Intel Security ha annunciato oggi al Mobile World Congress le proprie collaborazioni con Deutche Telecom e Prestigio che aiuteranno gli utenti finali a dire addio al problema delle password sui dispositivi mobile. È indubbio che le password stanno diventando un problema, con il sempre maggior utilizzo dei dispositivi mobili. In media oggi gli utenti mobili Italiani hanno circa 33 app installate sul proprio dispositivo mobile di cui 14 utilizzate nell’ultimo mese e 5 nell’ultimo giorno*. E ricordare le password complesse e i nomi utente necessari per accedere alle varie applicazioni è sempre più difficile, soprattutto se si considera che l’utente medio ha 25 account online e deve memorizzare circa 10 diverse password.True Key di Intel Security è un’applicazione che si installa sul telefono, sul tablet o sul computer per aiutare gli utenti ad accedere più rapidamente ai propri dispositivi, app e siti web e preferiti, senza dover digitare o ricordare più password. Utilizzando elementi biometrici, come il riconoscimento dei tratti del viso, o le impronte digitali sui dispositivi supportati, True Key consente agli utenti di identificarsi ai servizi e applicazioni online, dicendo addio al problema di dover ricordare tutte le password, nella massima sicurezza, e consentendo di personalizzare il livello di protezione con l’aggiunta di ulteriori elementi di sicurezza all’accesso. (foto: intel security)

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McAfee sceglie Dubai per il primo Cyber Defense Center

Posted by fidest press agency su mercoledì, 4 settembre 2013

McAfee headquarters in Santa Clara, California.

McAfee headquarters in Santa Clara, California. (Photo credit: Wikipedia)

Dubai, Emirati Arabi Uniti – 4 settembre 2013 – McAfee ha annunciato oggi l’apertura a Dubai del proprio primo Cyber Defense Center (CDC) per offrire assistenza in caso di incidenti, valutazioni di sicurezza e formazione per i clienti nella regione EMEA (Europa, Medio Oriente e Africa). Il lancio del CDC, il primo di McAfee a livello globale, è arrivato al momento giusto per quest’area geografica, dal momento che lo scorso anno sono state molte le aziende che hanno assistito ad attacchi di grande portata, e si prevede che il CDC sarà un ulteriore strumento per aiutare a proteggere la regione EMEA dalle minacce emergenti che si manifesteranno. I governi della regione hanno investito diffusamente in nuove soluzioni per prevenire e ridurre al minimo l’impatto degli attacchi e il CDC di McAfee sarà un elemento di collaborazione importante con gli attori principalmente interessati a cercare nuovi modi per migliorare la protezione.Il panorama delle minacce in continua evoluzione ha favorito la domanda di servizi di sicurezza sofisticati e sorretti da forti competenze ed esperienza nel mercato EMEA. Il Centro non solo fornirà servizi di intervento di emergenza agli incidenti e di analisi forense di elevata qualità ( supportata dal nuovo laboratorio McAfee di sicurezza forense all’avanguardia basato a Dubai), ma fornirà anche servizi strategici peculiari che differenziano McAfee da altri vendor nella regione, tra cui: informazioni contestuali sulle minacce, analisi informative Open Source, valutazioni per la protezione contro gli attacchi DDos, Analisi forense digitale e delle minacce malware mirate. Un nutrito portafoglio di servizi strategici di McAfee che continuerà a evolvere per rispondere al panorama delle minacce in continua evoluzione e per aiutare i clienti a stare almeno dieci passi avanti rispetto ai ‘cattivi’. Il gruppo CDC si compone di consulenti esperti, con più di 70 anni di esperienza combinata, nel trattamento di risposta agli incidenti sia nel settore pubblico che privato.L’apertura di questo centro rafforza ulteriormente la presenza di McAfee in EMEA e le consente di consigliare alle imprese i modi migliori per proteggere le risorse e massimizzare gli obiettivi di business grazie a una sicurezza robusta ed efficace.Nel corso dell’ultimo anno, è stato rilevato un enorme aumento del malware e degli attacchi mirati alle organizzazioni in EMEA. Per esempio, nel secondo trimestre 2013 in Ucraina e in Bielorussia è stato registrato un aumento dello spam di oltre il 200%. In Medio Oriente, il CDC sta monitorando una famiglia di malware finalizzato a frodi finanziarie e furto di dati, che è molto attivo in paesi come Arabia Saudita, Emirati Arabi Uniti e Qatar. Molte delle violazioni che sono state osservate negli ultimi mesi sono iniziate con attacchi che eseguono un’azione SQL-injection in siti web e banche dati dei clienti per poi diffondersi in rete a un livello più profondo. E’ stata poi monitorata una crescente attività di gruppi di hacker che stanno prendendo di mira le industrie e i governi, oltre a quelli che si muovono spinti dalla possibilità di guadagno finanziario, motivazioni politiche o per rubare la proprietà intellettuale.
McAfee, società interamente controllata da Intel Corporation (NASDAQ:INTC), consente ad aziende, pubbliche amministrazioni e utenti consumer di usufruire dei vantaggi di Internet in modo sicuro. L’azienda offre prodotti e servizi di sicurezza riconosciuti e proattivi che proteggono sistemi, reti e dispositivi mobili in tutto il mondo. Grazie alla strategia Security Connected, a un approccio innovativo nella creazione di soluzioni sempre più sicuri e all’ineguagliato servizio di Global Threat Intelligence, McAfee è impegnata senza sosta a ricercare nuovi modi per mantenere protetti i propri clienti.

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Supermicro® Debuts New X9 DP and 4-Way MP Platforms

Posted by fidest press agency su martedì, 15 Maggio 2012

San Jose, California, (PRNewswire) Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server technology and green computing, announces it is shipping server solutions optimized for Intel® Xeon® E5-2400 “Sandy Bridge-EN” and E5-4600 “Sandy Bridge-EP” series processors.
New X9 Dual-Processor (DP) solutions offer a cost optimized entry point for Data Centers looking for best power usage effectiveness (PUE). Systems built around Supermicro’s compact 12″ x 10″ form factor (X9DBL-3/i(F), X9DAL-3/i) and UIO (X9DBU-3/iF) “B2” socket motherboards are engineered with high quality, cost-effective components delivering customers the best performance-cost ratio. They feature memory capacities of up to 192GB (X9DAL, X9DBL) and 384GB (X9DBU), plus PCI-E 3.0 support. SuperServers based on the X9DBU series motherboard feature Supermicro’s innovative UIO architecture that supports full height expansion cards in 1U and 2U chassis making them ideal for data center and network/security appliances (6017B-NTF, 6017B-URF, 1027B-URF, and 2U 6027B-URF). SuperWorkstations based on the X9DAL series motherboard are ideal for CAE/MCAD/ECAD/GIS, video editing, and 3D animation (7037A-iL). SuperServers based on the X9DBL series motherboard are ideal PUE optimized servers for Data Centers, web servers, search engine appliances, gaming systems and ATMs (6017B-MTF, 6017B-MTLF, 6017B-MTRF, 1027B-MTF).
Supermicro’s X9 4-Way Multi-Processor (MP) platforms targeting high-end Enterprise IT and high performance computing (HPC) are also available supporting Intel’s latest Xeon® processor E5-4600 family. Supermicro will exhibit its new X9 4-Way platform at Intel Developer Forum (IDF) Brazil, May 15. 4-Way servers are built around Supermicro’s high-end MP serverboards (X9QR7/i-(T)F+, X9QR7/i-(J)(T)F) which are designed to maximize the performance and energy efficiency, making them ideal for mission critical and data-intensive applications. Supermicro’s new advanced 4-Way platforms support a massive 1TB ECC Reg. DDR3 memory in 32 DIMM slots and feature up to 8x PCI-E 3.0 x16 expansion slots, onboard 6Gbps SAS/SATA hardware and host-based RAID controllers, an onboard dual-port 10GBase-T Intel® Ethernet controller and redundant Platinum level high-efficiency (94%+) digital switching power supplies. SuperServer® solutions are available in 1U (8017R-TF+/7FT+), 2U (8027R-TRF+/7RFT+), 4U Tower (8047R-TRF+/7RFT+) and 4U SuperStorage (8047R-7JRFT/4047R-7JRFT) systems. Engineering, scientific, computational finance and geophysics applications can all benefit from the enhanced CPU, I/O, expansion and networking capabilities of Supermicro’s new 4-Way MP platforms.
Supermicro’s exhibits at IDF Brazil include the debut of the 4-Way 8017R-7FT+, a 2U SuperServer 2027GR-TRF optimized for Intel MIC and the innovative 2U Twin2® 6027TR-H70RF. Also on display will be Supermicro’s new X9 MicroCloud 5037MR-H8TRF supporting the Intel® Xeon® E5-2600 processor family. For more information on Supermicro’s complete line of high-performance, high-efficiency server and storage solutions, visit
About Super Micro Computer, Inc. Supermicro® (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its “We Keep IT Green®” initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

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Development of Emerging Memory Technologies

Posted by fidest press agency su giovedì, 1 marzo 2012

Santa Clara, Calif. and Boise, Idaho, Feb. 28, 2012 (GLOBE NEWSWIRE) — Intel Corporation (Nasdaq:INTC) and Micron Technology, Inc. (Nasdaq:MU), today announced that the companies have entered into agreements to expand their NAND Flash memory joint venture relationship.The agreements, which are designed to improve the flexibility and efficiency of the joint venture, include a NAND Flash supply agreement for Micron to supply NAND products to Intel and agreements for certain joint venture assets to be sold to Micron. Under terms of the agreement, Intel is selling its stake in two wafer factories in exchange for approximately $600 million—the approximate book value of Intel’s share. Additionally, Intel will be receiving approximately half of the consideration in cash and the remaining amount will be deposited with Micron, which may be refunded or applied to Intel’s future purchases under the NAND Flash supply agreement. The agreements also extend the companies’ successful NAND Flash joint development program and expand it to include emerging memory technologies.”Micron’s joint venture NAND development efforts with Intel are a model of innovation, productivity and effectiveness,” said Micron Chief Executive Officer Mark Durcan. “With IM Flash and its associated programs, our companies have become leaders in the NAND Flash arena. These new agreements build on that success.””The Intel-Micron partnership has created industry-leading NAND Flash memory technology and developed a robust global manufacturing network. The new NAND Flash supply agreement with Micron gives Intel better flexibility to meet growing demand for SSDs and other products,” said Robert Crooke, Corporate Vice President and General Manager of the Non-Volatile Memory Solutions Group, Intel.
As part of these agreements, Micron will increase its share of the overall NAND Flash output and optimize its global manufacturing network by purchasing the assets of IM Flash Singapore (IMFS) and the IM Flash Technologies (IMFT) assets in Manassas, Va.Micron has also agreed to supply Intel with NAND Flash memory from its facilities. The IMFT joint venture NAND manufacturing facility in Lehi, Utah, will continue to operate with minimal changes to its existing operations. The facility is currently in production on the companies’ industry-leading 20nm NAND Flash memory technology. The transaction is expected to close during the first half of this year, subject to certain conditions.Intel (Nasdaq:INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at and
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit Micron Technology, Inc. logo is available at

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Intel Development Forum

Posted by fidest press agency su sabato, 17 settembre 2011

The headquarters of Intel Corporation in Santa...

Image via Wikipedia

Santa Clara, California, Amplidata, an innovator in unbreakable, low power object storage technology, demonstrates the Cloud Builders reference architecture of its next generation AmpliStor system that leverages Intel’s Xeon™ processor technology at Intel Development Forum.
Data storage solutions have come to an impasse. The demand trajectory to store enormous amounts of data continues to rise, but growth remains hindered by the technical limitations of current solutions that store multiple data copies or deploy RAID to protect against disk failures. New solutions are needed to counter the existing problems with operating costs, power consumption and data loss. Amplidata addresses these issues in AmpliStor a durable and reliable storage platform that features industry-leading erasure coding technology to exceed customer durability requirements. Amplidata’s AmpliStor, solves the critical reliability and data integrity issues that RAID is known for on multi-terabyte disk drives. The technology is unbreakable and is in excess of 100,000 times more reliable than existing RAID-based solutions, essentially eliminating the chance of data loss. The new Amplidata solution will provide even greater performance and increase the reliability without compromising the cost per TB. As a member of the Intel Cloud Builders ecosystem, the Xeon™ optimized AmpliStor reference architecture is a clear demonstration of a converged storage platform. The scalar storage architecture reaps the benefits of Intel’s high-performance processors and provides customized, enterprise-class data durability while minimizing power consumption. The platform scales from a few nodes to multiple datacenters by simply adding storage nodes, to offer private or public cloud storage services across the enterprise WAN or the internet. AmpliStor provides high throughput and parallel data access powered by Intel Xeon processors while improving storage efficiencies and halving power consumption, as it requires fewer drives.
Amplidata was founded in 2008 with a team of storage veterans who developed an Optimized Object Storage (OOS) system specifically for unstructured data. The solution, called AmpliStor, provides “Ten 9’s” of storage durability, high-performance and power efficiency at the lowest possible cost of ownership. AmpliStor scales to Petabytes and beyond, and requires 50-70% less storage capacity to protect data compared to alternative solutions. Amplidata has its operational and R&D headquarters in Lochristi, Belgium, with US operations based in Redwood City, CA.

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