Fidest – Agenzia giornalistica/press agency

Quotidiano di informazione – Anno 32 n° 312

Posts Tagged ‘micron’

Covid-19: Micron offre aiuti finanziari

Posted by fidest press agency su domenica, 29 marzo 2020

Micron Technology, Inc. (Nasdaq: MU), ha annunciato oggi l’intenzione di devolvere 35 milioni di dollari a beneficio delle persone colpite in misura sproporzionata dal virus COVID-19. L’azienda lancerà un nuovo fondo di beneficenza Micron Foundation per un totale di 10 milioni di dollari, aumenterà i cofinanziamenti sovvenzionati e istituirà un programma di aiuti economici per il personale. Micron offrirà inoltre assistenza in natura per velocizzare il pagamento dei piccoli fornitori locali e donerà strutture e forniture mediche per rispondere all’emergenza sanitaria.

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Micron Technology to Host Analyst Conference

Posted by fidest press agency su domenica, 4 agosto 2013

BOISE, Idaho, 2013-08-02 14:00 CEST (GLOBE NEWSWIRE) conference, 10 a.m. – 12 p.m. ET. A replay will be available via the Website until Sept. 9, 2013.– Micron Technology, Inc. (Nasdaq:MU) will host an analyst conference on Friday, Aug. 9, 2013. Mark Durcan, Micron’s Chief Executive Officer, and other executive officers will present Micron’s strategy, discuss the company’s recent acquisition of Elpida Memory, Inc., and provide an update on current market conditions.At the analyst conference, presentations by Micron officers will start at 10 a.m. ET. The analyst meeting will be Webcast, featuring live audio and slides, at
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.
Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

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Micron Updates Anticipated Timing of Closing of Elpida Transactions

Posted by fidest press agency su martedì, 30 luglio 2013

BOISE, Idaho, (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU) (“Micron”) announced today that it anticipates the closing of Micron’s acquisition of 100 percent of Elpida’s equity to occur on July 31, 2013, Tokyo time.The closing of the acquisition will be pursuant to a Sponsor Agreement entered into on July 2, 2012, in connection with Elpida’s corporate reorganization proceedings conducted under the jurisdiction of the Tokyo District Court. The closing of the transaction is subject to satisfaction or waiver of a number of conditions, including final approval by the Tokyo District Court.
Micron also anticipates concurrently closing its acquisition of a 24 percent share of Rexchip Electronics Corporation from Powerchip Technology Corporation and certain of its affiliates.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

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Micron’s Hybrid Memory Cube Named Memory Product of the Year by EE Times and EDN

Posted by fidest press agency su domenica, 28 aprile 2013

Boise, Idaho, 2013-04-24 21:00 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc., (Nasdaq:MU) announced today that its Hybrid Memory Cube was named the Memory Product of the Year by a panel of industry experts. The award was announced this week at the EE Times and EDN ACE Awards Event at Design West, the annual technical conference for electronics design engineers, entrepreneurs and technology professionals. This year’s awards mark a critical juncture in the industry, as system designers across a broad range of applications look for new memory system designs that will support increased demands for bandwidth, density and power efficiency. Hybrid Memory Cube (HMC) has been recognized by industry leaders and influencers as the long-awaited answer to the growing gap between the performance improvement rate of DRAM versus processor data consumption rate – a dilemma known as the “memory wall.””Electronic Design News and EE Times are two of the industry’s most influential and well-read publications by design engineers and system architects,” said Brian Shirley, vice president of Micron’s DRAM solutions group. “We are honored that they share our vision for the unprecedented impact and value that Hybrid Memory Cube brings to the electronics industry.”An industry breakthrough, HMC uses advanced through-silicon vias (TSVs) – vertical conduits that electrically connect a stack of individual chips – to combine high-performance logic with Micron’s state-of-the-art DRAM chips. HMC delivers bandwidth and efficiencies a leap beyond current device capabilities, blasting data 15 times faster than a DDR3 module and using 70 percent less energy and 90 percent less space than existing technologies. Micron expects to ship the first engineering samples of this revolutionary technology later this year.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.©2013 Micron Technology, Inc. All rights reserved. Information is subject to change without notice. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This news release contains forward-looking statements regarding the production of Hybrid Memory Cube. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron’s most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

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Micron Technology, Inc., Reports Results for the Second Quarter of Fiscal 2013

Posted by fidest press agency su venerdì, 22 marzo 2013

Boise, Idaho, (GLOBE NEWSWIRE) — Micron Technology, Inc., (Nasdaq:MU) today announced results of operations for its second quarter of fiscal 2013, which ended February 28, 2013. For the second quarter, the company had a net loss attributable to Micron shareholders of $286 million, or $0.28 per diluted share, on net sales of $2.1 billion. The results for the second quarter of fiscal 2013 compare to a net loss of $275 million, or $0.27 per diluted share, on net sales of $1.8 billion for the first quarter of fiscal 2013, and a net loss of $282 million, or $0.29 per diluted share, on net sales of $2.0 billion for the second quarter of fiscal 2012.Results of operations for the second quarter of fiscal 2013 include losses of $120 million from changes in the market value of the company’s currency hedges entered into in connection with its planned acquisition of Elpida Memory, Inc. and Rexchip Electronics Corporation. The results also include a loss of $62 million associated with the expected sale of the company’s 200 millimeter wafer fabrication facility in Avezzano, Italy, in the first half of calendar 2013.The company’s consolidated gross margin improved to 18 percent in the second quarter of fiscal 2013 compared to 12 percent in the first quarter of fiscal 2013. Gross margin improvements were realized from sales of NAND Flash products and from sales of DRAM products due to decreases in manufacturing costs.Revenues from sales of DRAM products in the second quarter of fiscal 2013 were 24 percent higher compared to the first quarter of fiscal 2013, due to a 38 percent increase in sales volume partially offset by a 10 percent decrease in average selling prices. Revenues from sales of NAND Flash products were 8 percent higher in the second quarter of fiscal 2013 compared to the first quarter of fiscal 2013, primarily due to a 13 percent increase in Trade NAND Flash sales volume. Sales of NOR Flash products were 14 percent lower in the second quarter of fiscal 2013, compared to the first quarter of fiscal 2013, due to decreases in sales volumes and average selling prices.Cash flows from operations for the first six months of fiscal 2013 were $470 million, while investments in capital expenditures were $891 million. In the second quarter of fiscal 2013, the company issued $600 million of convertible senior notes. In connection therewith, the company used $477 million to repurchase a portion of its 2014 notes. The company ended the quarter with cash and investments of $2.8 billion.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND Flash and NOR Flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.

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Micron Technology apporta miglioramenti all’accordo di Joint Venture Inotera Memories

Posted by fidest press agency su sabato, 19 gennaio 2013

Boise, Idaho, (GLOBE NEWSWIRE) Micron Technology, Inc. (Nasdaq: MU) ha oggi annunciato di aver stipulato accordi con Nanya Technology Corporation per migliorare il loro rapporto nella joint venture riguardante Inotera Memories Inc., un importante produttore taiwanese di memorie DRAM, e apportare perfezionamenti al loro accordo di sviluppo congiunto. I nuovi accordi hanno effetto immediato. Le modifiche includono un nuovo accordo di fornitura tra Micron e Inotera in base al quale Micron si preparerà all’acquisto di tutta la produzione manifatturiera di Inotera, con Micron che acquisterà sostanziale tutta la produzione a partire dai primi mesi del 2013. In base agli accordi precedenti, Nanya e Micron erano generalmente obbligate ad acquistare metà della produzione di Inotera. Anche i termini commerciali del nuovo accordo di fornitura tra Micron e Inotera sono cambiati. Secondo il nuovo accordo, il prezzo di acquisto di Micron per la produzione di Inotera è basato sul prezzo di mercato, anziché in relazione alla condivisione del margine, come era previsto dal precedente accordo. Inoltre Nanya non parteciperà più al programma di sviluppo tecnologico delle DRAM in collaborazione con Micron, che è stato avviato quando Micron e Nanya avevano creato la joint venture di Inotera nel 2008. Micron, inoltre, fornirà a Nanya una licenza tecnologica soggetta a royalty.
Micron e Nanya collettivamente continueranno a detenere la maggioranza delle azioni di Inotera, tenendo conto che Nanya, o le sue società affiliate, acquisiranno probabilmente nel prossimo anno una partecipazione di capitale maggiore. Micron, Nanya e i loro affiliati attualmente sono rispettivamente in possesso di circa il 40 per cento e il 29 per cento delle azioni in circolazione di Inotera.Gli accordi oggi annunciati non cambiano le stime del secondo trimestre fiscale 2013 precedentemente comunicate riguardanti la crescita della produzione di bit DRAM, della ricerca e sviluppo e del prezzo di vendita medio trimestrale stimato (includendo il mix di prodotti previsti per il trimestre) e il costo per bit.
Micron Technology Inc. è uno dei maggior fornitori al mondo di soluzioni avanzate per semiconduttori. Attraverso i suoi impianti di produzione a livello mondiale la Micron produce e commercializza una gamma completa di memorie DRAM, memorie flash NAND e NOR, così come altre tecnologie di memoria innovative, moduli di memoria e sistemi a semiconduttori per l’uso in prodotti d’avanguardia, prodotti al consumo, per il networking, per la telefonia mobile e sistemi integrati. Le azioni ordinarie della Micron sono quotate al NASDAQ con il simbolo MU. Per ulteriori informazioni su Micron Technology Inc., visitare il sito http://www.micron.com

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Micron Technology Amends Inotera Memories Joint Venture With Nanya Technology Corporation

Posted by fidest press agency su venerdì, 18 gennaio 2013

Boise, Idaho, Micron Technology, Inc. (Nasdaq:MU) today announced that it has entered into agreements with Nanya Technology Corporation to amend their joint venture relationship involving Inotera Memories, Inc., a leading Taiwanese DRAM memory manufacturer, and to amend their joint development arrangement. The new agreements are effective immediately.The amendments include a new supply agreement between Micron and Inotera pursuant to which Micron is transitioning to purchase all of Inotera’s manufacturing output, with Micron purchasing substantially all of such output beginning in early 2013. Under the prior agreements, Nanya and Micron were each generally obligated to purchase half of Inotera’s output. Commercial terms of the new supply agreement between Micron and Inotera have also changed. Under the new arrangement, Micron’s purchase price for Inotera output is market based as opposed to the former margin sharing arrangement.Additionally, Nanya will no longer participate in the DRAM technology joint development program with Micron, which was initiated when Micron and Nanya entered into the Inotera joint venture in 2008. Micron will also provide Nanya with a royalty-bearing technology license.Micron and Nanya collectively will continue to hold a majority of Inotera’s shares, with Nanya or its affiliated companies likely acquiring greater equity ownership over the next year. Micron and Nanya and their affiliates currently own approximately 40 percent and 29 percent, respectively, of Inotera’s outstanding shares.The agreements announced today do not change Micron’s previously announced fiscal second quarter 2013 estimates for DRAM production bit growth, research and development, estimated quarter to date average selling price (including forecasted product mix for the quarter) and cost per bit.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.

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Glen Hawk sarà il keynote di Micron al Flash Memory Summit del 2012

Posted by fidest press agency su martedì, 14 agosto 2012

Boise, Idaho, 2012-08-14 07:04 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), uno dei principali fornitori al mondo di soluzioni avanzate per semiconduttori, ha annunciato che Glen Hawk, vice presidente del gruppo NAND Solutions, sarà il keynote al Flash Memory Summit che si terrà martedì 21 agosto presso il Santa Clara Convention Center in Santa Clara, California. Con 28 anni di esperienza nel settore dei semiconduttori, pienamente incentrata sulle memorie non volatili, Hawk spiegherà come le architetture basate sulle memorie Flash stanno rendendo possibile un mondo interconnesso, offrendo ovunque un accesso rapido alle informazioni. Oltre al keynote di Hawk, gli esperti tecnici di Micron guideranno più di una dozzina di sessioni specialistiche in cui si discuteranno le ultime tendenze dei mercati consumer ed enterprise che guidano l’architettura e lo sviluppo delle memorie Flash. Queste presentazioni si svolgeranno durante il summit, che avrà luogo dal 21 al 23 agosto. Dalle nuove applicazioni Flash NOR fino alle interfacce di tipo PCIe da 2,5 pollici per le cache Flash enterprise, Micron presenterà le differenti soluzioni Flash a più di 2.000 progettisti, ingegneri tecnici di marketing e product manager, provenienti da aziende produttrici di elettronica di consumo, computer, comunicazioni, militari e sistemi di difesa, controllo industriale e di processo, apparecchiature di prova e di strumentazione.

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Micron Announces Its First Fully Functional DDR4 DRAM Module

Posted by fidest press agency su sabato, 12 maggio 2012

Boise, Idaho, (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), one of the world’s leading providers of advanced semiconductor solutions, today announced development of its first fully functional DDR4 DRAM module. The company has begun sampling and has received feedback from major customers to support quick implementation for applications in 2013. It is expected that the enterprise and micro-server markets will take full advantage of the new features and specifications designed into DDR4, accelerating early adoption of the technology. In addition, the fast-growing ultrathin client and tablet markets will also benefit from new opportunities enabled by the power savings and performance features of Micron’s DDR4. Codeveloped by Nanya and based on Micron’s 30-nanometer (nm) technology, the 4-gigabit (Gb) DDR4 x8 part is the first piece of what is expected to be the industry’s most complete portfolio of DDR4-based modules, which will include RDIMMs, LRDIMMs, 3DS, SODIMMs and UDIMMs (standard and ECC). For the soldered down space, x8, x16, and x32 components will also be available, with initial speeds up to 2400 megatransfers per second (MT/s), increasing to the JEDEC-defined 3200 MT/s.
As JEDEC finalizes the DDR4 specifications, Micron is positioned to quickly become fully compliant with its 30nm 4Gb DDR4 part. Full sampling to key partners began earlier this year and volume production is planned for 4Q12.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of SSDs, DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.

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Micron Technology Confirms Discussions With Elpida Memory Trustees

Posted by fidest press agency su venerdì, 11 maggio 2012

Boise, Idaho, (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), today confirmed it is engaged in discussions with Elpida Memory, Inc.’s trustees to acquire Elpida’s business.Micron made the announcement following a May 10 approval by the Tokyo District Court allowing Elpida’s trustees to negotiate an agreement with Micron, pursuant to which Micron would become Elpida’s sponsor and acquire Elpida’s entire business in accordance with the corporate reorganization proceedings. Elpida, a semiconductor DRAM memory manufacturer, filed a petition for commencement of Corporate Reorganization Proceedings with the Tokyo District Court under the Corporate Reorganization Act of Japan on Feb. 27, 2012, which proceedings have been commenced. Elpida recently undertook a bidding process to select a company to “sponsor” Elpida during its Corporate Reorganization proceedings and to acquire the company’s business. In that process, Elpida has decided to move forward in negotiations with Micron as the potential sponsor.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.The Micron Technology, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=6950 Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

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Microsoft Joins Hybrid Memory Cube Consortium, Which Aims to Break Down Memory Wall

Posted by fidest press agency su mercoledì, 9 maggio 2012

Boise, Idaho and SAN JOSE, Calif.(GLOBE NEWSWIRE) — The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc. (Nasdaq:MU), and Samsung Electronics Co., Ltd., today announced that Microsoft Corp. has joined the consortium. The HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for an innovative new memory technology called the Hybrid Memory Cube (HMC). Micron and Samsung, the initial developing members of the HMCC, are working closely with Altera, IBM, Open-Silicon, Xilinx and now Microsoft to accelerate widespread industry adoption of HMC technology.The technology will enable highly efficient memory solutions for applications ranging from industrial products to high-performance computing and large-scale networking. The HMCC’s team of developers plans to deliver a draft interface specification to a growing number of “adopters” that are joining the consortium. Then, the combined team of developers and adopters will refine the draft and release a final interface specification at the end of this year.Adopter membership in the HMCC is available to any company interested in joining the consortium and participating in the specification development. The HMCC has responded to interest from more than 75 prospective adopters.As envisioned, HMC capabilities will leap beyond current and near-term memory architectures in the areas of performance, packaging and power efficiencies, offering a major shift from present memory technology. By opening new doors for developers, manufacturers and architects, the consortium is committed to making HMC a new standard in high-performance memory technology.
One of the primary challenges facing the industry — and a key motivation for forming the HMCC — is that the memory bandwidth required by high-performance computers and next-generation networking equipment has increased beyond what conventional memory architectures can provide. The term “memory wall” has been used to describe this dilemma. Breaking through the memory wall requires architecture such as the HMC that can provide increased density and bandwidth at significantly reduced power consumption.
Founded by leading members of the world’s semiconductor community, the Hybrid Memory Cube Consortium (HMCC) is dedicated to the development and establishment of an industry-standard interface specification for the Hybrid Memory Cube technology. Members of the consortium presently include Micron, Samsung, Altera, Open-Silicon, Xilinx, IBM and Microsoft. More than75 prospective adopters are exploring consortium membership. To learn more about the HMCC, visit http://www.hybridmemorycube.org.

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The offering is expected to close on April 18, 2012, subject to customary closing conditions

Posted by fidest press agency su sabato, 14 aprile 2012

In connection with the offering of the Notes, Micron entered into capped call transactions relating to shares of Micron common stock with a number of counterparties. The capped call transactions are expected to reduce the potential dilution upon conversion of the Notes. The capped call transactions relating to the 2032C Notes have a lower strike price of $9.80 and capped prices ranging from $14.26 to $15.69, which are 100% to 120% higher than the closing price of Micron’s common stock on April 12, 2012. The capped call transactions relating to the 2032D Notes have a lower strike price of $10.16 and capped prices ranging from $14.62 to $16.04, which are 105% to 125% higher than the closing price of Micron’s common stock on April 12, 2012. In connection with establishing their initial hedge of these capped call transactions, Micron expects that the counterparties will enter into various over-the-counter derivative transactions with respect to Micron’s common stock concurrently with, or shortly after, the pricing of the Notes and may unwind or enter into various over-the-counter derivatives and/or purchase Micron’s common stock in secondary market transactions after the pricing of the Notes. These activities could have the effect of increasing or preventing a decline in the price of Micron’s common stock concurrently with or following the pricing of the Notes. In addition, the counterparties may modify or unwind their hedge positions by entering into or unwinding various derivative transactions and/or purchasing or selling Micron’s common stock in secondary market transactions prior to maturity of the Notes (and are likely to do so on each exercise date of the capped call transactions.This announcement is neither an offer to sell nor a solicitation to buy any of the foregoing securities, nor shall there be any sale of the securities in any jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such jurisdiction.The securities will not be registered under the Securities Act, or any state securities laws, and unless so registered, may not be offered or sold in the United States except pursuant to an exemption from the registration requirements of the Securities Act and applicable state laws.

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Micron Announces Pricing of Convertible Senior Notes Offerings

Posted by fidest press agency su sabato, 14 aprile 2012

Boise, Idaho, (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU) today announced the pricing of an offering of $480.0 million aggregate principal amount of its 2.375% convertible senior notes due 2032 (the “2032C Notes”) and $390.0 million aggregate principal amount of its 3.125% convertible senior notes due 2032 (the “2032D Notes” and, together with the 2032C Notes, the “Notes”). The Notes are being offered in the United States to qualified institutional buyers pursuant to Rule 144A under the Securities Act of 1933, as amended (the “Securities Act”). Micron has granted the initial purchasers an option to purchase up to an additional $70.0 million aggregate principal amount of 2032C Notes and up to an additional $60.0 million aggregate principal amount of 2032D Notes on the same terms and conditions to cover over-allotments, if any. Interest on the 2032C Notes will be paid semi-annually at a rate of 2.375% per year and will mature on May 1, 2032, unless earlier repurchased, redeemed or converted. Interest on the 2032D Notes will be paid semi-annually at a rate of 3.125% per year and will mature on May 1, 2032, unless earlier repurchased, redeemed or converted.
Holders may require Micron to repurchase the 2032C Notes for cash on May 1, 2019 and the 2032D Notes for cash on May 1, 2021, in each case at a purchase price equal to the principal amount thereof plus accrued and unpaid interest to, but excluding the repurchase date. In addition, holders may require Micron to repurchase their Notes upon a change of control or a termination of trading at a purchase price equal to the principal amount thereof plus accrued and unpaid interest to, but excluding the repurchase date.
Each series of Notes will be convertible, subject to the satisfaction of certain conditions, into cash or shares of Micron common stock or a combination thereof, at Micron’s election. The initial conversion rate per $1,000 principal amount of 2032C Notes is equivalent to 103.8907 shares of common stock, which is equivalent to a conversion price of approximately $9.63 per share of common stock, subject to adjustment in certain circumstances. This initial conversion price represents a premium of 35% relative to the last reported sale price on April 12, 2012 of Micron’s common stock of $7.13. The initial conversion rate per $1,000 principal amount of 2032D Notes is equivalent to 100.1803 shares of common stock, which is equivalent to a conversion price of approximately $9.98 per share of common stock, subject to adjustment in certain circumstances. This initial conversion price represents a premium of 40% relative to the last reported sale price on April 12, 2012 of Micron’s common stock of $7.13.
On or after May 1, 2016, in the case of the 2032C Notes, and on or after May 1, 2017, in the case of the 2032D Notes, Micron may redeem for cash all or part of the Notes if the volume weighted average price of its common stock has been at least 130% of the conversion price then in effect for such series of Notes for at least 20 trading days during any 30 consecutive trading day period ending within five trading days prior to the date on which Micron provides notice of redemption. The redemption price will equal the principal amount of the Notes to be redeemed, plus accrued and unpaid interest to, but excluding, the redemption date. If Micron redeems the Notes prior to May 4, 2019, in the case of the 2032C Notes, or prior to May 4, 2021, in the case of the 2032D Notes, it will make a “make-whole premium” payment in cash equal to the present value of all remaining scheduled payments of interest that would have been made on the Notes to be redeemed had such Notes remained outstanding from the redemption date to May 4, 2019, in the case of the 2032C Notes, or to May 4, 2021, in the case of the 2032D Notes. Holders who convert Notes in connection with such redemption will also be entitled to such make-whole premium payment. On or after May 4, 2019, in the case of the 2032C Notes, and on or after May 4, 2021, in the case of the 2032D Notes, Micron may redeem for cash all or part of the Notes at a redemption price equal to the principal amount of the Notes to be redeemed, plus accrued and unpaid interest thereon.

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Micron Technology Settles Lawsuit With Oracle

Posted by fidest press agency su venerdì, 30 marzo 2012

The Carnegie library in Boise, Idaho.

The Carnegie library in Boise, Idaho. (Photo credit: Wikipedia)

Boise, Idaho, (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), announced today that it reached an agreement with Oracle America Inc. (“Oracle”) to settle a lawsuit filed by Oracle against Micron in the U.S. District Court for the Northern District of California. The lawsuit alleged a conspiracy to increase DRAM prices and other violations of federal and state antitrust and unfair competition laws based on purported conduct for the period from Aug. 1, 1998, through at least June 15, 2002, and sought joint and several damages, trebled, as well as restitution, disgorgement, attorneys’ fees, costs and injunctive relief. Pursuant to the settlement agreement, the parties agreed to a settlement and release of all claims and a dismissal with prejudice of the litigation. Under applicable accounting principles, the effect of this settlement on Micron’s results of operations for the second fiscal quarter of 2012 is a reduction in revenue and an increase in the net loss attributable to Micron shareholders of $58 million as compared to the results previously reported on March 22, 2012, with corresponding adjustments to other items included in the company’s results of operations. As a result, for the second quarter of fiscal 2012, Micron’s net loss attributable to its shareholders was $282 million, or $0.29 per diluted share, on net sales of $2.009 billion. The full effect of the settlement on Micron’s results of operations and financial position for the second quarter of fiscal 2012 will be provided in Micron’s Form 10-Q. Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.

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Development of Emerging Memory Technologies

Posted by fidest press agency su giovedì, 1 marzo 2012

Santa Clara, Calif. and Boise, Idaho, Feb. 28, 2012 (GLOBE NEWSWIRE) — Intel Corporation (Nasdaq:INTC) and Micron Technology, Inc. (Nasdaq:MU), today announced that the companies have entered into agreements to expand their NAND Flash memory joint venture relationship.The agreements, which are designed to improve the flexibility and efficiency of the joint venture, include a NAND Flash supply agreement for Micron to supply NAND products to Intel and agreements for certain joint venture assets to be sold to Micron. Under terms of the agreement, Intel is selling its stake in two wafer factories in exchange for approximately $600 million—the approximate book value of Intel’s share. Additionally, Intel will be receiving approximately half of the consideration in cash and the remaining amount will be deposited with Micron, which may be refunded or applied to Intel’s future purchases under the NAND Flash supply agreement. The agreements also extend the companies’ successful NAND Flash joint development program and expand it to include emerging memory technologies.”Micron’s joint venture NAND development efforts with Intel are a model of innovation, productivity and effectiveness,” said Micron Chief Executive Officer Mark Durcan. “With IM Flash and its associated programs, our companies have become leaders in the NAND Flash arena. These new agreements build on that success.””The Intel-Micron partnership has created industry-leading NAND Flash memory technology and developed a robust global manufacturing network. The new NAND Flash supply agreement with Micron gives Intel better flexibility to meet growing demand for SSDs and other products,” said Robert Crooke, Corporate Vice President and General Manager of the Non-Volatile Memory Solutions Group, Intel.
As part of these agreements, Micron will increase its share of the overall NAND Flash output and optimize its global manufacturing network by purchasing the assets of IM Flash Singapore (IMFS) and the IM Flash Technologies (IMFT) assets in Manassas, Va.Micron has also agreed to supply Intel with NAND Flash memory from its facilities. The IMFT joint venture NAND manufacturing facility in Lehi, Utah, will continue to operate with minimal changes to its existing operations. The facility is currently in production on the companies’ industry-leading 20nm NAND Flash memory technology. The transaction is expected to close during the first half of this year, subject to certain conditions.Intel (Nasdaq:INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.The Micron Technology, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=6950

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Micron Launches New Product Category of Low-Standby-Power

Posted by fidest press agency su venerdì, 10 febbraio 2012

Boise Idaho, CET (GLOBE NEWSWIRE) Micron Technology, Inc. (Nasdaq:MU) is extending its legacy of memory leadership by introducing a new product category of low-power DDR3 solutions targeted at the tablet and ultrathin markets. These 2-gigabit (Gb) and 4Gb “DDR3Lm” solutions focus on low self-refresh power (IDD6) for longer battery life, while maintaining the high performance and cost effectiveness of PC DRAM. The first 2Gb DDR3Lm will provide up to 50 percent self-refresh power savings versus standard 2Gb DDR3L while driving performance up to -1600 MT/s when needed. Micron’s 4Gb DDR3Lm product delivers the same optimized power efficiency as the 2Gb part, with a reduced chip count that is ideally suited for ultrathin and tablet customers. Both 2Gb and 4Gb DDR3Lm will be adopted into Micron’s 30-nanometer (nm) class to further optimize the power and performance features, with the 4Gb device hitting a 3.7mA IDD6 target in standby mode, yet still supporting speeds up to -1866 MT/s. “Power reduction is becoming ever more critical in the fast growing ultrathin markets. Micron’s expertise with traditional PC memory requirements enables these markets to enjoy high performance targets and optimal cost efficiencies,” said Robert Feurle, vice president for Micron’s DRAM marketing. “The combination of our commitment to customer collaboration and dedication to leading the way in DRAM technologies has proven highly successful, and this new class of 30nm DRAM continues to deliver on that promise.” “As computing becomes more and more mobile, longer battery life is increasingly valuable to end users,” said Geof Findley, Intel’s senior memory enabling manager. “The reduced standby power consumption of low-power memory is a move in the right direction.”
Sampling of Micron’s new DDR3Lm low-power product line begins now, with volume production on 30nm class devices expected to begin in 2Q’12. For more information about DDR3Lm, visit http://www.micron.com/products/dram/ddr3-sdram.

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Micron Technology nomina Mark Durcan come Amministratore Delegato (CEO) della società

Posted by fidest press agency su martedì, 7 febbraio 2012

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Boise, Idaho (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), ha annunciato oggi la nomina di D. Mark Durcan come Amministratore Delegato (CEO) della società. Mr. Durcan presiederà anche come Direttore del Consiglio di Amministrazione di Micron. Le nomine vengono annunciate dopo che la società ha riferito che Steven R. Appleton, da lungo tempo Presidente del Consiglio di Amministrazione e CEO di Micron, è deceduto in un incidente aereo avvenuto il 3 febbraio a Boise. Il Consiglio di Amministrazione ha inoltre annunciato la nomina del Direttore Robert E. Switz come Presidente del Consiglio di Amministrazione e Mark W. Adams come Direttore Generale della società. Mr. Switz ha prestato servizio come Direttore dal 2006 ed è stato ex Presidente del Consiglio di Amministrazione e CEO di ADC Telecommunications. In precedenza ha prestato servizio come Presidente del Consiglio Audit di Micron e dei comitati di gestione e controllo. Mr. Adams ha iniziato a far parte della compagnia nel 2006 e recentemente a prestato servizio come Vice Presidente delle vendite a livello mondiale.Mr. Durcan, 51 anni, ha prestato servizio come Direttore Generale e Direttore Operativo di Micron dal 2007 e precedentemente ha prestato servizio come Chief Technology Officier. È entrato in azienda nel 1984.
Micron Technology Inc., è uno dei maggior fornitori al mondo di soluzioni avanzate per semiconduttori. Attraverso i suoi impianti di produzione a livello mondiale la Micron produce e commercializza una gamma completa di memorie DRAM, memorie flash NAND e NOR, così come altre tecnologie di memoria innovative, moduli di memoria e sistemi di semiconduttori per l’uso in prodotti d’avanguardia, prodotti al consumo, per il networking, per la telefonia mobile e sistemi integrati. Le azioni ordinarie della Micron sono quotate al NASDAQ con il simbolo MU. Per ulteriori informazioni su Micron Technology Inc., visitare il sito http://www.micron.com
Micron e il logo Micron sono marchi commerciali di proprietà di Micron Technology Inc. Tutti gli altri marchi commerciali sono di proprietà dei rispettivi titolari.

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Micron Technology terrà una conferenza per gli analisti

Posted by fidest press agency su lunedì, 6 febbraio 2012

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Boise, Idaho, 6 febbraio 2012 (GLOBE NEWSWIRE) – Micron Technology, Inc. (Nasdaq: MU), ospiterà una conferenza per gli analisti Venerdì 10 febbraio 2012. Mark Durcan, Amministratore Delegato (CEO) della società, insieme ad altri dirigenti presenterà la strategia di Micron e fornirà un aggiornamento sulle attuali condizioni di mercato. Le presentazioni dei funzionari di Micron, per la conferenza con gli analisti, inizieranno alle ore 7:00 del fuso orario statunitense MT. L’incontro con gli analisti sarà disponibile sul Webcast, con audio e diapositive in diretta, presso l’indirizzo Web http://www.micron. com/investors/conference venerdì dalle ore 7:00 alle ore 10:00 del fuso orario statunitense MT. Una replica sarà disponibile sul sito Web fino al 10 marzo 2012. Micron Technology Inc., è uno dei maggior fornitori al mondo di soluzioni avanzate per semiconduttori. Attraverso i suoi impianti di produzione a livello mondiale la Micron produce e commercializza una gamma completa di memorie DRAM, memorie flash NAND e NOR, così come altre tecnologie di memoria innovative, moduli di memoria e sistemi di semiconduttori per l’uso in prodotti d’avanguardia, prodotti al consumo, per il networking, per la telefonia mobile e sistemi integrati. Le azioni ordinarie della Micron sono quotate al NASDAQ con il simbolo MU. Per ulteriori informazioni su Micron Technology Inc., visitare il sito http://www.micron.com Il logo di Micron Technology Inc. é disponibile presso: http://www.globenewswire.com/newsroom/prs/?pkgid=6950Micron e il logo Micron sono marchi commerciali di proprietà di Micron Technology Inc. Tutti gli altri marchi commerciali sono di proprietà dei rispettivi titolari.

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Saction Creates Enterprise Solution Synergies With Virtensys PCIe-Sharing

Posted by fidest press agency su domenica, 22 gennaio 2012

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Boise, Idaho (GLOBE NEWSWIRE) Micron Technology, Inc. (Nasdaq:MU), and Virtensys Ltd. today announced that the companies have signed an agreement for Micron to acquire the assets of privately held Virtensys, a provider of PCIe-sharing solutions based in Manchester, England and Beaverton, Ore.The transaction would further strengthen Micron’s enterprise storage portfolio by combining Virtensys’ award-winning PCIe virtualization technology with Micron’s solid state drives (SSDs), enabling data centers to share local storage across multiple servers.”Virtensys’ PCIe-sharing technology has helped change the way data center operators manage and deploy their virtualized I/O resources, and Micron’s enterprise PCIe drive delivers market-leading speed, reliability and power efficiency,” said Edward Doller, Micron Vice President and Chief Memory Systems Architect. “This agreement would enable a combination of enterprise technology solutions that have the opportunity to virtualize SSD storage on the path to a more flexible and dynamic data center.””Virtensys has served as an OEM focused company working to deliver innovative solutions with some of the world’s leading server, storage and I/O adapter manufacturers,” said John Nicholson, Virtensys Chairman and CEO. “Our technology complements Micron’s enterprise products as we strive to empower the virtual data center, and we are delighted to join the Micron family.”The transaction is subject to closing conditions and is currently anticipated to close by the end of the month. Specific terms of the proposed agreement are confidential.
Micron Technology, Inc., is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit http://www.micron.com.The Micron Technology, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=6950

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Micron: chiusura acquisizione di Numonyx

Posted by fidest press agency su martedì, 11 maggio 2010

Boise, Idaho, e Ginevra, Micron Technology, Inc., (Nasdaq:MU) ha annunciato il completamento dell’acquisizione, da parte della sua società, di Numonyx B.V. in una transazione all-stock del valore di circa $ 1,2 miliardi USD. In base all’accordo, Micron ha emesso circa 138 milioni di quote di titoli ordinari Micron agli azionisti Numonyx, Intel, STMicroelectronics, N.V. e Francisco Partners, e ha previsto le unità di azioni vincolate circolanti possedute dai dipendenti Numonyx. La transazione rafforza ulteriormente l’ampio portfolio Micron di prodotti di memoria DRAM, NAND e NOR e consolida l’esperienza nello sviluppo e nel supporto delle soluzioni per sistemi di memoria. Inoltre, Micron guadagna una maggiore scala di entrate e di produzione insieme all’accesso alla base di clienti di Numonyx, fornendo delle significative opportunità per aumentare le offerte multi-chip nei mercati embedded e mobile. Al 31 dicembre 2009, Numonyx ha riportato delle risorse nette pari a $ 1,3 miliardi e contanti e relativi equivalenti, con un netto di debiti verso parti non correlate parti a $ 70 milioni. Nel quarto trimestre di calendario, Numonyx ha generato $ 42 milioni di flusso di cassa operativo, basato sugli utili trimestrali pari a circa $ 550 milioni.
Micron Technology, Inc., è un fornitore leader nel mondo di soluzioni a semiconduttore di alta qualità. Grazie alle attività in tutto il mondo, Micron produce e commercializza componenti DRAM, memorie flash NAND, altri componenti a semiconduttore e moduli di memoria utilizzati nei più avanzati sistemi di computer, prodotti di consumo, networking, telefoni cellulari. I normali prodotti di Micron vengono commercializzati nei paesi NASDAQ con il simbolo MU.Per ulteriori informazioni su Micron Technology, Inc., consultate il sito http://www.micron.com.

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