Fidest – Agenzia giornalistica/press agency

Quotidiano di informazione – Anno 31 n° 259

Posts Tagged ‘semiconductor’

Global and China Semiconductor Equipment Industry Report

Posted by fidest press agency su mercoledì, 12 giugno 2019

The semiconductor industry with a high technical threshold is advancing speedily. Every generation of products requires unique processes and equipment.The semiconductor process involves monocrystalline silicon wafer fabrication, IC design, IC manufacturing, IC packaging, and testing. The production of monocrystalline silicon wafers needs monocrystalline furnace; and six types of equipment are indispensable to IC manufacturing, including lithography machine, etching machine, thin film equipment, diffusion/ion implantation equipment, wet process equipment, and process detector. Among semiconductor equipment, wafer foundry equipment accounts for about 80% of procurement, testing equipment 8%, packaging equipment 7%, and silicon wafer plant equipment and others 5%.Characterizing a rather high concentration, semiconductor equipment manufacturing is a typical capital- and technology-intensive sector with high technical barriers and in want of huge capital and manpower. In 2018, the world’s top ten semiconductor equipment vendors commanded a combined 71.4% market share, and the top five giants enjoyed 61.4% market shares together. Of the top ten, ASML comes from the Netherlands and the rest are based in the United States and Japan.The localization rate of semiconductor equipment in Mainland China is merely 11.5%, and the China-made semiconductor equipment makes up roughly 2% of the global market. In 2018, the global sales of semiconductor equipment achieved $61.6 billion including $10.1 billion or 16.4% from Chinese Mainland which is the third largest market after Taiwan and South Korea. Yet, there is still a huge technical gap between the semiconductor equipment made in China and foreign peers. In a word, Chinese equipment with low brand awareness is less competitive and take small market shares.

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The “Global Semiconductor Packaging Materials Market 2017-2021”

Posted by fidest press agency su venerdì, 29 dicembre 2017

semiconduttoriThe report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors operating in this market. One of the major drivers for this market is the increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT. There is an increasing drive toward the mobility of electronic devices, worldwide. To be portable and cost-effective, they need to be lightweight and small. This trend toward the adoption of smaller form factors has called for innovative developments in the semiconductor packaging materials. Packaging technologies such as SiP, PoP, Flip-chip, and WLP is driving the development of new material solutions.For instance, a conductive bump is soldered on top of the flipped chip in flip-chip packaging, that acts as an interconnect with the lead frame or substrate. It ensures high system density and improved performance in miniaturized packages. With increasing functionalities required from the small device, the SiP technology is employed as it packs in ICs of different functionalities along with other passive components such as connectors and filters.

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ON Semiconductor Announces Pricing of Private Offering of $600 Million of 1.00% Convertible Senior Notes

Posted by fidest press agency su giovedì, 4 giugno 2015

PHOENIX, Ariz, Ariz. ON Semiconductor Corporation (NASDAQ: ON), (“ON Semiconductor”) announced today the pricing of its previously announced private offering of $600 million aggregate principal amount of 1.00% Convertible Senior Notes due 2020 (the “notes”). The notes were offered only to qualified institutional buyers in accordance with Rule 144A under the Securities Act of 1933, as amended (the “Securities Act”). ON Semiconductor has granted to the initial purchasers of the notes a 30-day option to purchase up to an additional $90 million aggregate principal amount of notes. The offering is expected to close on June 8, 2015, subject to customary closing conditions.
The notes will be ON Semiconductor’s senior unsecured obligations and guaranteed by certain of its subsidiaries. The notes will bear interest at a rate of 1.00% per year, payable semiannually in arrears on June 1 and December 1 of each year, beginning on December 1, 2015. The notes will mature on December 1, 2020.The initial conversion rate for the notes is 54.0643 shares of ON Semiconductor’s common stock per $1,000 principal amount of notes (equivalent to an initial conversion price of approximately $18.50 per share of ON Semiconductor’s common stock), which represents an approximately 42.50% conversion premium over the last reported sale price of $12.98 per share of ON Semiconductor’s common stock on The NASDAQ Global Select Market on June 2, 2015.
Prior to September 1, 2020, the notes will be convertible only upon satisfaction of certain conditions and during certain periods, and thereafter, at any time until the close of business on the second scheduled trading day immediately preceding the maturity date. Upon any conversion, ON Semiconductor will settle its conversion obligation in cash, shares of its common stock, or a combination of cash and shares of its common stock, at its election.In connection with the pricing of the notes, ON Semiconductor has entered into privately negotiated convertible note hedge transactions with one or more of the initial purchasers of the notes or their affiliates or other financial institutions (the “hedge counterparties”). The convertible note hedge transactions will cover, subject to customary anti-dilution adjustments, the same number of shares of common stock as those underlying the notes, and are expected to reduce the potential dilution to ON Semiconductor’s common stock and/or offset potential cash payments upon conversion of the notes.
ON Semiconductor has also entered into privately negotiated warrant transactions with the hedge counterparties relating to the same number of shares of ON Semiconductor common stock as the convertible note hedge transactions. The strike price of the warrant transactions will initially be $25.96 per share, which represents an approximately 100% premium to the last reported sale price of ON Semiconductor’s common stock on The NASDAQ Global Select Market on June 2, 2015. The warrant transactions could have a dilutive effect to ON Semiconductor’s common stock to the extent that the market price per share of ON Semiconductor’s common stock exceeds the strike price of the warrants. If the initial purchasers exercise their option to purchase additional notes, ON Semiconductor may enter into additional convertible note hedge and warrant transactions.
In connection with establishing their initial hedge of the convertible note hedge and warrant transactions, the hedge counterparties, or their affiliates, expect to purchase shares of ON Semiconductor’s common stock and/or enter into various derivative transactions with respect to ON Semiconductor’s common stock concurrently with or shortly after the pricing of the notes. In addition, the hedge counterparties, or their affiliates, may modify their hedge positions by entering into or unwinding various derivative transactions with respect to our common stock and/or by purchasing or selling ON Semiconductor common stock or other securities of ON Semiconductor in secondary market transactions prior to the maturity of the notes, and are likely to do so during any observation period related to a conversion of notes. These hedging activities could have the effect of increasing, or reducing the size of any decline in, the market price of ON Semiconductor’s common stock or the notes at that time.
ON Semiconductor intends to use the net proceeds: to fund the cost of the convertible note hedge transactions described above (the cost of which will be partially offset by the proceeds that ON Semiconductor will receive from entering into the warrant transactions described above); to fund the repurchases of up to $100 million of ON Semiconductor’s common stock, of which approximately $70 million has been purchased from purchasers of notes in the offering in privately negotiated transactions effected through one or more of the initial purchasers or its affiliates conducted concurrently with the pricing of the notes, and the balance of which is expected to be purchased in the open market after the pricing of the notes, to repay $350 million of borrowings outstanding under its revolving credit facility and for general corporate purposes, including additional share repurchases and potential acquisitions.The purchase price per share of ON Semiconductor’s common stock in repurchases conducted concurrently with the pricing of the notes was equal to the last reported sale price of $12.98 per share of ON Semiconductor’s common stock on the NASDAQ Global Select Market on June 2, 2015. Any share repurchases conducted concurrently with the pricing of the notes or afterwards could increase, or prevent a decrease in, the market price of ON Semiconductor’s common stock or the notes, which could result in a higher effective conversion price for the notes, affect the ability of the holders to convert the notes and, to the extent such repurchase occurs during any observation period related to a conversion of the notes, affect the amount and value of the consideration that holders will receive upon conversion of the notes.
ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions.

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ON Semiconductor Announces Proposed Private Offering of $600 Million of Convertible Senior Notes

Posted by fidest press agency su mercoledì, 3 giugno 2015

PHOENIX, ArizPHOENIX, Ariz. ON Semiconductor Corporation (NASDAQ: ON), announced that it intends to offer, subject to market and other conditions, $600 million aggregate principal amount of Convertible Senior Notes due 2020 (the “notes”) in a private offering. The notes will be offered only to qualified institutional buyers in accordance with Rule 144A under the Securities Act of 1933, as amended (the “Securities Act”). ON Semiconductor also expects to grant to the initial purchasers of the notes a 30-day option to purchase up to an additional $90 million aggregate principal amount of notes.ON Semiconductor intends to use the net proceeds: to fund the cost of the convertible note hedge transactions described below (the cost of which will be partially offset by the proceeds that ON Semiconductor will receive from entering into the warrant transactions described below); (ii) to fund the repurchases of up to $100 million of ON Semiconductor common stock, up to $70 million of which is expected to be purchased from purchasers of notes in the offering in privately negotiated transactions effected through one or more of the initial purchasers or its affiliates conducted concurrently with the pricing of the notes, and the balance of which is expected to be purchased in the open market after the pricing of the notes, to repay $350 million of borrowings outstanding under its revolving credit facility and for general corporate purposes, including additional share repurchases and potential acquisitions.ON Semiconductor expects the purchase price per share of its common stock in repurchases conducted concurrently with the pricing of the notes to equal the last reported sale price per share of its common stock on the NASDAQ Global Select Market on the date of the pricing of the notes. Any such repurchases could increase, or prevent a decrease in, the market price of ON Semiconductor’s common stock concurrently with the pricing of the notes, and could result in a higher effective conversion price for the notes.In connection with the offering of the notes, ON Semiconductor intends to enter into privately negotiated convertible note hedge and warrant transactions with one or more of the initial purchasers of the notes or their affiliates or other financial institutions (the “hedge counterparties”). The convertible note hedge transactions will cover, subject to customary anti-dilution adjustments, the same number of shares of common stock as those underlying the notes, and are expected to reduce the potential dilution to ON Semiconductor’s common stock and/or offset potential cash payments upon conversion of the notes. The warrants will give the hedge counterparties the right to purchase up to the same number of shares of common stock as those underlying the notes, subject to customary anti-dilution adjustments. The warrant transactions could have a dilutive effect to ON Semiconductor’s common stock to the extent that the market price per share of ON Semiconductor’s common stock exceeds the strike price of the warrants. If the initial purchasers exercise their option to purchase additional notes, ON Semiconductor may enter into additional convertible note hedge and warrant transactions.In connection with establishing their initial hedge of the convertible note hedge and warrant transactions, the hedge counterparties, or their affiliates, expect to purchase shares of ON Semiconductor’s common stock and/or enter into various derivative transactions with respect to ON Semiconductor’s common stock concurrently with or shortly after the pricing of the notes. In addition, the hedge counterparties, or their affiliates, may modify their hedge positions by entering into or unwinding various derivative transactions with respect to our common stock and/or by purchasing or selling our common stock or other securities of ours in secondary market transactions prior to the maturity of the notes, and are likely to do so during any observation period related to a conversion of notes. These hedging activities could have the effect of increasing, or reducing the size of any decline in, the market price of ON Semiconductor’s common stock or the notes at that time.The notes will be ON Semiconductor’s senior unsecured obligations and guaranteed by certain of its subsidiaries. The notes will mature on December 1, 2020, unless earlier repurchased or converted. Upon any conversion, ON Semiconductor will settle its conversion obligation in cash, shares of its common stock, or a combination of cash and shares of its common stock, at its election. The interest rate on, the initial conversion rate of, and other terms of the notes will be determined by negotiations between ON Semiconductor and the initial purchasers of the notes.The notes, guarantees and shares of ON Semiconductor common stock issuable upon conversion, if any, have not been registered under the Securities Act, or under any U.S. state securities laws or other jurisdiction and may not be offered or sold in the United States absent registration or an applicable exemption from registration requirements.
ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions.

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ON Semiconductor Announces New Capital Allocation Policy; Board of Directors Approves $1 Billion Share Repurchase Program

Posted by fidest press agency su martedì, 2 dicembre 2014

semiconductorON Semiconductor (Nasdaq: ONNN), driving energy efficient innovations, today announced that its Board of Directors has approved a capital allocation policy under which the company intends to return approximately 80 percent of free cash flow less repayments of long-term debt to shareholders, subject to a variety of factors, including the company’s strategic plans, market and economic conditions, and Board of Directors’ discretion. ON Semiconductor defines free cash flow as net cash provided by operating activities less purchases of property, plant and equipment of the company and its consolidated subsidiaries.The Board of Directors also approved a new share repurchase program under the new policy. Under the new share repurchase program, the company intends to repurchase approximately $1 billion worth of its common shares over a four year period, subject to the same factors and considerations described above. The new stock repurchase program is effective today and the $300 million stock repurchase program announced in August of 2012 has been terminated.“The new capital allocation policy demonstrates ON Semiconductor’s strong commitment towards efficient use of capital and maximizing shareholder value,” said Keith Jackson, president and CEO of ON Semiconductor. “We believe that at current levels, our stock offers compelling value, and therefore the repurchase program should deliver substantial value to our shareholders. The long term outlook for our business remains strong, driven by a robust design win pipeline, and we are confident in our ability to generate approximately $300 million to $400 million of annual free cash flow on a sustained basis in the near to mid-term.”Based on the closing price of the company’s common stock as of November 28 2014, the $1 billion repurchase program represents the potential repurchase of approximately 111 million shares or 25 percent of the weighted average diluted common shares outstanding at the end of the third quarter of 2014.
ON Semiconductor (Nasdaq: ONNN) is driving energy efficient innovations, empowering customers to reduce global energy use. The company offers a comprehensive portfolio of energy-efficient power and signal management, logic, discrete and custom solutions to help design engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power supply applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit http://www.onsemi.com.

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Microsoft Joins Hybrid Memory Cube Consortium, Which Aims to Break Down Memory Wall

Posted by fidest press agency su mercoledì, 9 maggio 2012

Boise, Idaho and SAN JOSE, Calif.(GLOBE NEWSWIRE) — The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc. (Nasdaq:MU), and Samsung Electronics Co., Ltd., today announced that Microsoft Corp. has joined the consortium. The HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for an innovative new memory technology called the Hybrid Memory Cube (HMC). Micron and Samsung, the initial developing members of the HMCC, are working closely with Altera, IBM, Open-Silicon, Xilinx and now Microsoft to accelerate widespread industry adoption of HMC technology.The technology will enable highly efficient memory solutions for applications ranging from industrial products to high-performance computing and large-scale networking. The HMCC’s team of developers plans to deliver a draft interface specification to a growing number of “adopters” that are joining the consortium. Then, the combined team of developers and adopters will refine the draft and release a final interface specification at the end of this year.Adopter membership in the HMCC is available to any company interested in joining the consortium and participating in the specification development. The HMCC has responded to interest from more than 75 prospective adopters.As envisioned, HMC capabilities will leap beyond current and near-term memory architectures in the areas of performance, packaging and power efficiencies, offering a major shift from present memory technology. By opening new doors for developers, manufacturers and architects, the consortium is committed to making HMC a new standard in high-performance memory technology.
One of the primary challenges facing the industry — and a key motivation for forming the HMCC — is that the memory bandwidth required by high-performance computers and next-generation networking equipment has increased beyond what conventional memory architectures can provide. The term “memory wall” has been used to describe this dilemma. Breaking through the memory wall requires architecture such as the HMC that can provide increased density and bandwidth at significantly reduced power consumption.
Founded by leading members of the world’s semiconductor community, the Hybrid Memory Cube Consortium (HMCC) is dedicated to the development and establishment of an industry-standard interface specification for the Hybrid Memory Cube technology. Members of the consortium presently include Micron, Samsung, Altera, Open-Silicon, Xilinx, IBM and Microsoft. More than75 prospective adopters are exploring consortium membership. To learn more about the HMCC, visit http://www.hybridmemorycube.org.

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